DRAM KGD9
KGD DRAM PieceMakers Technology is devoted to offer a variety of DRAM KGD solutions that are compliant with the JEDEC standard. We are here to help customers make System-In-Package and Multiple-Chip-Package products. Our KGD chips can be custom designed to provide advanced features that extend beyond that of our standard commercial products. By ordering our KGD products, we provide a variety of additional technical services. PieceMakers provide custom designed DDR Custom Design Features for Advantageous Performance: Overdrive Bandwidth bandwidths can be adjusted beyond the standard specifications for optimal solution. Lower Power Consumption Voltage output can be adjusted in accordance with the needs of customers. Ultra-wide temperature range temperature ranges can be small or large and from ultra-low to ultra-high temperatures as specified by customers. Pad Redistribution Layer (RDL) PieceMakers ensure the best pad position to redistribute the circuit for SiP and specific pad/die matching. Custom Design Support Pad/Die Matching PieceMakers provides recommendations on how to match the memory die with SoC die and their corresponding pads. We also assess whether RDL is needed. Performance Simulation PieceMakers provide IBIS simulation for speed after pad/die matching. Testability Recommen- dation PieceMakers provide high-tech recommendations on how to test the packaged IC. |
